Semi tools. Vacuum chambers. Wafer handling.
Semiconductor manufacturing equipment. Vacuum chambers, wafer handlers, gas distribution, lithography hardware. UHV-grade 316L stainless, electropolished.
Semiconductor manufacturing
Smooth surface (Ra 0.4 µm) doesn't trap contaminants. UHV-compatible. Industry standard.
Key principles.
316L EP
UHV chambers. Electropolished. Helium leak tested.
316L EP manifolds
Process gas manifolds. UHV-rated.
Various
Wafer handling robots, end-effectors.
Specialty
Lithography stages, optics mounts.
Specialty alloys
Plasma chambers. Specialized materials.
ISO Class 4-7
Materials compatible with cleanroom environment.
FAQ
Smooth surface (Ra 0.4 µm) doesn't trap contaminants. UHV-compatible. Industry standard.
UHV applications need 10⁻⁹ atm·cc/sec leak rate. Helium leak detected.
Materials must not outgas, particles. 316L EP, PTFE, certain plastics.
Semi tools: 50-1000 systems/year typical. Equipment makers OEMs.
UHV certification, electropolish certification, helium leak rate documentation.
Prototype 4-6 weeks. Production 6-8 weeks. UHV testing adds 2-3 weeks.
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