Channels machined. Valves integrated. Leak-tight.

Hydraulic manifolds 700 bar standard, special designs to 1000 bar. Wall thickness calculated per stress analysis. Pressure tested 1.5× working pressure.

316L stainless, electropolished to Ra 0.4 µm or better, vacuum baked-out. Helium leak tested to 10⁻⁹ atm·cc/sec. Standard for semiconductor process gas distribution.

ASME BPE: 316L electropolished Ra 0.5 µm wetted surfaces, full drainable design, sanitary connections. USP Class VI elastomeric materials. Documentation per GMP.

Internal flow paths created by drilled passages. Cross-bores plugged with: pipe plugs (low pressure), set screws + sealant (medium), bonded plugs (high pressure). Plug failure mode considered.

Standard cavities (ISO 7368, SAE J973) machined per spec. Integration with cartridge valves enables compact manifold designs.

4-6 weeks for typical hydraulic manifold. 6-8 weeks for semiconductor electropolished. Pressure testing and documentation add 1-2 weeks.